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| email: jrandall@zyvexlabs.com |
John Randall has over twenty years of experience in micro-
and nanofabrication. He is a key contributor to the new Zyvex
Labs. He originally joined Zyvex in March of 2001 after fifteen
years at Texas Instruments where he worked in high resolution
processing for integrated circuits, MEMS, and quantum effect
devices. Prior to working at TI, John worked at MIT’s
Lincoln Laboratory on ion beam and x-ray lithography.
• Vice President of Zyvex Labs (2007 – present)
• Chief Technical Officer at Zyvex Corporation (2001–2007)
• Senior Staff Scientist at Zyvex Corporation.
Developing Micro- Electro Mechanical Systems (MEMS) and Nano-
Electro Mechanical Systems (NEMS). (3/2001–5/2001)
Distinguished Member Technical Staff, Kilby
Research Center Texas Instruments in Dallas, Texas. He was
the Leader of the Poly Silicon Gate patterning Team which
developed lithography and etching of sub-tenth micron gates
for TI’s most advanced Integrated Circuit technology.
(1998–2001)
• Senior Member Technical Staff, TI Assignee
to IMEC in Leuven Belgium. He worked on Optical Proximity
Correction and other aspects of state-of-the-art optical Lithography.
(1996–1998)
• Senior Member Technical Staff, Nanoelectronics
Branch Texas Instruments, Dallas, Texas. He developed high
resolution processing techniques which resulted in several
World’s First accomplishments including: Quantum Dot
Diode, Quantum Well Resonant Tunneling Transistor, Lateral
heterostructure tunneling transistor, and room temperature
quantum integrated circiut. (1985–1996)
• Member Technical Staff, M.I.T. Lincoln
Laboratory in Lexington, Massachusetts. Developed ultra-high
resolution semiconductor processing techniques including masked
ion beam lithography which produced 80nm lines and spaces.
(1981–1985)
•Instructor in Electrical Engineering
Dept. Univ. of Houston. Where he taught Electro Magnetics,
Material Science, Linear Algebra, Programming, and Numerical
Methods. (1978–1981)
• BS in Electrical Engineering, (Cum Laude)
Honors Program,
University of Houston (1975)
• MS in Electrical Engineering, University of Houston
(1977)
• PhD in Electrical Engineering, University of Houston
(1981)
• Technology Roadmap Steering Committee,
Foresight Institute (2005)
• External Advisory Committee, Nano-Bio Interface Center,
University of Pennsylvania (2004)
• Imago Scientific Instruments Corporation Technical
Advisory Board (2004)
• Advisory committee and webmaster of the International
Conference on Electron Ion and Photon Beam Technologies and
Nanofabrication (1996–2000)
• International Steering Committee of European Micro-
Nano- Engineering Conference
• U.S. Editor of Micro Electronic Engineering Journal
(1999–2000)
• President of the Texas Chapter of the American Vacuum
Society (1993)
• Program committee of the International Electron Devices
Meeting, Technical Advisory Committee of the Advanced Lithography
Consortium
• Program committee of the SPIE Micro Lithography Conference
(2000)
• Technical Advisory Committee of University of Maryland’s
LIBRA Program
• IEEE member
• American Vacuum Society member
• Tau Beta Pi: National Engineering Honor Society
• Eta Kappa Nu: National E.E. Honor Society
• Alpha Lamda Delta/Phi Eta Sigma: National Freshman
Honor Society (Honorary Membership — Faculty Advisor)
• Elected Distinguished Member of the
Technical Staff (2000)
• Elected Conference Chairman for 1998 Gordon Conference
on Nanostructure Fabrication (1996)
• Elected Conference Chairman for 1995 International
Conference on Electron, Ion, and Photon Beams (1993)
• Elected Senior Member of the Technical Staff, Texas
Instruments (1990)
• Southwest Bell Outstanding Student Award (1975)
• National Collegiate Judo Champion (1974 & 1975)
• 4,827,138: Filled Grid Mask
• 5,160,845: Alignment Technique for Masked Ion Beam
Litho
• 5,096,846: Method of Forming a Quantum Effect Switching
Device
• 5,335,649: Stretching device
• 5,346,851: Method of Fabricating Shannon Cell Circuits
• 5,447,873: Universal Quantum Dot Logic Cell
• 5,504,347: Lateral Resonant Tunneling Device
• 5,529,862: Low Distortion Stencil Mask
• 5,529,952: Method of fabricating lateral resonant
tunneling structure
• 5,593,908: Lateral Resonant Tunneling
• 5,618,383: Narrow lateral dimensioned microelectronic
structures and method for forming same
• 5,665,997: Grated Landing Area to Eliminate sticking
of Micro-mechanical devices
• 5,763,121: Low Distortion Stencil Mask (a divisional
application of 5,529,952)
• 5,783,840: Universal Quantum Dot Logic Cell (continuation
of 5,447,873)
• 6,100,477: Recessed Etched RF Micro Electro Mechanical
Switch
• 6,139,483: Method of Forming Lateral Resonant Tunneling
Devices
• 6,553,558: Integrated circuit layout and verification
method
• 6,643,018: Optical Proximity Correction
• 6,686,102: Two-exposure phase shift photolithography
with improved inter-feature
separation
• 6,686,300: Sub-critical-dimension integrated circuit
features
• 6,837,723: Self-actuating connector for coupling microcomponents
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