Zyvex’s patented MechTile™ connector and socket technology, along with our assembly expertise, is the key to enabling assembled microsystems. Using a standard SOI or surface micromachining process, the third dimension of MEMS can be realized. We have developed a unique attachment technology to fabricate and assemble MEMS elements into 3D NanoLock™ Structures.

Zyvex MechTile assembly technology allows parts to be removed from the wafer and inserted into custom sockets. Parts can be fabricated and assembled on the same die or onto die from multiple processes. Heterogeneous assembly can be realized with the assembly of metallic, glass, and plastic components, as well as silicon. Zyvex NanoLock Structures can be used to assemble small fixtures and receptacles for parts that cannot be patterned.

Since NanoLock connectors can be fabricated using a single layer (with a release step), the core design is compatible with a wide variety of fabrication technologies and foundries.

Parts can even be cascaded to form complex structures. For active devices, up to 8 electrical interconnects per element can be fabricated on the connector platform.

Cascaded assembled structures created with MechTile technology .

MechTile parts are designed to allow moderately precise assembly devices (with 1-5µm tolerance) to assemble structures that are much more precise. By putting precision into the part, rather than assembling the robot, NanoLock structures benefit from the precision features available in MEMS at an affordable assembly cost.

For more information on this product, please contact Dr. James Wylde at 972.792.1626 or by email at jwylde@zyvex.com.